+86-13553369060
取消

XCVM1502-1MLIVFVC1760

Part number XCVM1502-1MLIVFVC1760
Product classification System On Chip (SoC)
Manufacturer Xilinx (AMD)
Description IC VERSALPRIME ACAP FPGA 1760BGA
Encapsulation
Packing Tray
Quantity 0
RoHS status YES
Share
Inventory:
Total number

Quantity

Price

Total price

1

$6,965.8750

$6,965.8750

Obtain quotation information
Product parameters
PDF(1)
TYPEDESCRIPTION
MfrXilinx (AMD)
SeriesVersal™ Prime
PackageTray
Product StatusACTIVE
Package / Case1760-BFBGA, FCBGA
Speed600MHz, 1.3GHz
RAM Size256KB
Number of I/O500
Operating Temperature-40°C ~ 110°C (TJ)
Core ProcessorDual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Primary AttributesVersal™ Prime FPGA, 1M Logic Cells
ConnectivityCANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
PeripheralsDDR, DMA, PCIe
Supplier Device Package1760-FCBGA (40x40)
ArchitectureMPU, FPGA
Similar models
XCVM1502
AMD
ACAP

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
关闭
Inquiry
captcha

+86-13553369060

点击这里给我发消息
0