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TSE2004GB2B0NCG8/M

Part number TSE2004GB2B0NCG8/M
Product classification Thermal Management
Manufacturer Intersil (Renesas Electronics Corporation)
Description TEMPERATURE SENSOR
Encapsulation
Packing Bulk
Quantity 0
RoHS status NO
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Product parameters
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TYPEDESCRIPTION
MfrIntersil (Renesas Electronics Corporation)
Series-
PackageBulk
Product StatusOBSOLETE
Package / Case8-WFDFN Exposed Pad
Output TypeI2C/SMBus
Mounting TypeSurface Mount
FunctionTemp Monitoring System (Sensor)
Accuracy±2°C
Operating Temperature-40°C ~ 125°C
Voltage - Supply2.2V ~ 3.6V
Sensor TypeInternal
TopologyADC (Sigma Delta), Control Logic, Register Bank
Output AlarmNo
Output FanNo
Supplier Device Package8-VFQFPN (2x3)

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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