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TE0813-02-4BE81-A

Part number TE0813-02-4BE81-A
Product classification Microcontrollers, Microprocessor, FPGA Modules
Manufacturer Trenz Electronic
Description MODULE MPSOC 4GB DDR4
Encapsulation
Packing Box
Quantity 3
RoHS status NO
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$396.0880

$396.0880

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Product parameters
TYPEDESCRIPTION
MfrTrenz Electronic
SeriesZynq® UltraScale+™
PackageBox
Product StatusACTIVE
Connector TypeBGA
Size / Dimension2.047" L x 2.992" W (52.00mm x 76.00mm)
RAM Size2GB
Operating Temperature0°C ~ 85°C
Module/Board TypeFPGA
Core ProcessorXilinx Zynq UltraScale+ ZU4EG
Flash Size128MB

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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