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FEMC032GBE-TC40

Part number FEMC032GBE-TC40
Product classification Memory
Manufacturer Flexxon
Description IC FLASH 256GBIT EMMC 153FBGA
Encapsulation
Packing Tray
Quantity 8
RoHS status YES
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$24.9340

$24.9340

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TYPEDESCRIPTION
MfrFlexxon
SeriesXTRA V
PackageTray
Product StatusACTIVE
Package / Case153-VFBGA
Mounting TypeSurface Mount
Memory Size256Gbit
Memory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C
Voltage - Supply2.7V ~ 3.6V
TechnologyFLASH - NAND (TLC)
Clock Frequency200 MHz
Memory FormatFLASH
Supplier Device Package153-FBGA (11.5x13)
Memory InterfaceeMMC
Memory Organization32G x 8
DigiKey ProgrammableNot Verified

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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