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FEMC032GBB-T740

Part number FEMC032GBB-T740
Product classification Memory
Manufacturer Flexxon
Description IC FLSH 256GBIT EMMC 5.1 153FBGA
Encapsulation
Packing Tray
Quantity 264
RoHS status NO
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Inventory:
Total number

Quantity

Price

Total price

1

$25.5010

$25.5010

10

$23.6530

$236.5300

25

$22.8060

$570.1500

40

$22.2390

$889.5600

80

$19.4880

$1,559.0400

230

$18.9490

$4,358.2700

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Product parameters
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TYPEDESCRIPTION
MfrFlexxon
SeriesXTRA VIII
PackageTray
Product StatusACTIVE
Package / Case153-VFBGA
Mounting TypeSurface Mount
Memory Size256Gbit
Memory TypeNon-Volatile
Operating Temperature-40°C ~ 105°C
Voltage - Supply2.7V ~ 3.6V
TechnologyFLASH - NAND (TLC)
Clock Frequency200 MHz
Memory FormatFLASH
Supplier Device Package153-FBGA (11.5x13)
Memory InterfaceeMMC_5.1
Memory Organization32G x 8
DigiKey ProgrammableNot Verified

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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