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FEMC016GBE-T740

Part number FEMC016GBE-T740
Product classification Memory
Manufacturer Flexxon
Description IC FLSH 128GBIT EMMC 5.1 153FBGA
Encapsulation
Packing Tray
Quantity 193
RoHS status NO
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Inventory:
Total number

Quantity

Price

Total price

1

$19.4110

$19.4110

10

$18.2560

$182.5600

25

$17.6190

$440.4750

40

$17.0590

$682.3600

80

$15.0220

$1,201.7600

230

$14.6160

$3,361.6800

440

$14.1680

$6,233.9200

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Product parameters
PDF(1)
TYPEDESCRIPTION
MfrFlexxon
SeriesXTRA VII
PackageTray
Product StatusACTIVE
Package / Case153-VFBGA
Mounting TypeSurface Mount
Memory Size128Gbit
Memory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C
Voltage - Supply2.7V ~ 3.6V
TechnologyFLASH - NAND (TLC)
Clock Frequency200 MHz
Memory FormatFLASH
Supplier Device Package153-FBGA (11.5x13)
Memory InterfaceeMMC_5.1
Memory Organization16G x 8
DigiKey ProgrammableNot Verified

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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