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FEMC004GTTE7-T13-18

Part number FEMC004GTTE7-T13-18
Product classification Memory
Manufacturer Flexxon
Description IC FLASH 32GBIT EMMC 4.5 100FBGA
Encapsulation
Packing Tray
Quantity 98
RoHS status NO
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Inventory:
Total number

Quantity

Price

Total price

1

$9.9960

$9.9960

10

$9.2540

$92.5400

25

$9.1280

$228.2000

40

$9.0090

$360.3600

80

$7.8960

$631.6800

230

$7.5600

$1,738.8000

440

$7.5110

$3,304.8400

945

$7.0000

$6,615.0000

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Product parameters
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TYPEDESCRIPTION
MfrFlexxon
SeriesXTRA III
PackageTray
Product StatusACTIVE
Package / Case100-LBGA
Mounting TypeSurface Mount
Memory Size32Gbit
Memory TypeNon-Volatile
Operating Temperature-40°C ~ 85°C
Voltage - Supply2.7V ~ 3.6V
TechnologyFLASH - NAND (MLC)
Clock Frequency200 MHz
Memory FormatFLASH
Supplier Device Package100-FBGA (14x18)
Memory InterfaceeMMC_4.5
Memory Organization4G x 8
DigiKey ProgrammableNot Verified

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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