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27-121-015-0000

Part number 27-121-015-0000
Product classification RFI and EMI - Contacts, Fingerstock and Gaskets
Manufacturer Jones Tech
Description RFI COND FOAM PU NICKEL ADH
Encapsulation
Packing Box
Quantity 50
RoHS status YES
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Inventory:
Total number

Quantity

Price

Total price

1

$5.3830

$5.3830

10

$5.0750

$50.7500

50

$4.4450

$222.2500

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Product parameters
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TYPEDESCRIPTION
MfrJones Tech
Series-
PackageBox
Product StatusACTIVE
MaterialPolyurethane Foam, Nickel-Copper Taffeta (NI/CU)
Length0.394" (10.00mm)
ShapeRound
TypeConductive Foam
Width0.394" (10.00mm)
Operating Temperature-45°C ~ 85°C
Height0.394" (10.00mm)
Attachment MethodAdhesive
PlatingNickel

Roving Networks (Microchip Technology)
MEMS OSC XO 133.0000MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 24.5760MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 100.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSC XO 125.0000MHZ LVPECL
Roving Networks (Microchip Technology)
MEMS OSCILLATOR, ULTRA LOW POWER
Roving Networks (Microchip Technology)
MEMS OSC XO 133.3330MHZ CMOS SMD
Roving Networks (Microchip Technology)
MEMS OSC XO 175.0000MHZ LVDS SMD
Roving Networks (Microchip Technology)
MEMS OSC LOW JITTER 125MHZ LVDS
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